Fourier's waterless cooling solution for financial AI/HPC data centers adopts a patented GPU cold‑plate design using synthetic‑oil/fluorocarbon working fluids. Integrated vapor‑chamber (VC) structures provide ultra‑fast heat spreading, enabling cooling capacity beyond 2000W per chip. The approach eliminates electrochemical corrosion found in traditional water‑based cold plates and removes leakage risk to servers. It also preserves cold‑plate advantages: compatibility with standard server architectures, no reliance on immersion‑specific AOC optics with higher failure rates, and no bulk dielectric fluid around components that could impact high‑speed signal integrity.