Fourier's waterless cooling solution for financial AI/HPC data centers adopts a patented GPU cold‑plate design using synthetic‑oil/fluorocarbon working fluids. Integrated vapor‑chamber (VC) structures provide ultra‑fast heat spreading, enabling cooling capacity beyond 2000 W per chip. The approach eliminates electrochemical corrosion found in traditional water‑based cold plates and removes leakage risk to servers. It also preserves cold‑plate advantages: compatibility with standard server architectures, no reliance on immersion‑specific AOC optics with higher failure rates, and no bulk dielectric fluid around components that could impact high‑speed signal integrity.