Cooling the AI era with waterless, scalable,
energy-efficient cooling technology.

Fourier delivers liquid cooling solutions for high-density AI and HPC.
Built for performance, efficiency, and global deployment.

About Fourier

Fourier provides end-to-end liquid cooling solutions for high-density data centers. Centered on direct-to-chip and immersion liquid cooling solutions, we deliver complete, turnkey solutions.

Our focus is simple: enable AI, cloud, and edge workloads to run at higher density and lower PUE—reliably, safely, and at scale.

With large format manufacturing capacity and field proven engineering, we serve customers across North America, the Middle East, Central Asia and beyond. By combining advanced design with disciplined execution, we help operators accelerate the transition to efficient, green infrastructure.

Core Advantages

Excellence in Manufacturing

Large scale, dedicated facilities for liquid cooling equipment enable flexible production, strict quality assurance, and rapid delivery.

Excellence in Manufacturing
Excellence in Manufacturing

Comprehensive Solutions

Integrated R&D, manufacturing, site engineering, and operations support—one partner for design, deployment, and lifecycle services of high density server racks.

Comprehensive Solutions
Comprehensive Solutions

Trusted Service

Responsive, professional support with remote monitoring and on site assistance to keep critical workloads online.

Trusted Service
Trusted Service

Global Partners

Global Partners

Sustainability & Responsibility

Energy Efficiency by Design

Our architectures cut air side load and fan power, minimizing mechanical overhead. In suitable climates, deployments with free cooling dry coolers are engineered to achieve sub 1.20 PUE targets while maintaining performance headroom.

Waterless

Waterless in the white space—no water loops inside the data hall. Closed loop outdoor systems avoid continuous municipal water consumption, with optional adiabatic assist only where appropriate and governed by local requirements.

Heat Reuse Ready

Optional modules deliver 40–90 °C outlet water for space heating or process use, enabling practical energy recovery in new builds or retrofits.

Smaller Footprint, Smarter Siting

High rack densities reduce building area per unit of compute, enable brownfield reuse, lower acoustic impact from air handling, and improve compatibility with demand response strategies.

Fourier Powers the Future
of Al & HPC

Our global team is happy to assist with your modular data center project needs.
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