Targeted cooling for high-power chips inside server racks
Air-Liquid Integrated Rack
The Fourier air-liquid integrated server rack uses cold plates to transfer chip heat into the data center's internal air environment. it resolves localized high-power chip cooling challenges where only a small number of such chips exist inside the facility.
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Industry's Leading Innovation
Air-Liquid Integrated Rack
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Solution Features
65°C Ambient
Operates reliably in extreme heat, meeting the demands of high-temperature regions such as the Middle East.
Multi-Climate Regimes
Supports coolant temperature pairs of 25/45 °C, 38/45 °C, and 40/50 °C for diverse site conditions.
20kW+ Per Rack
Supports single-rack densities above 20kW for edge AI infrastructure without complex water systems.
Flexible Cold-Plate Options
1–8 node configurations, compatible with sealed front/rear server racks, UPS, lithium or lead-acid battery units, PDUs, and rack-mounted air conditioners.
≤1.25 PUE
Achieves low PUE with natural cooling in ≤26°C environments.
Hyperscale-Level Savings
Delivers energy efficiency comparable to top-tier data centers.
N+1 Redundancy
Equipped with N+1 fans and N+1 electronic pumps for high availability.
Hot-Swappable Design
Supports rapid on-site component replacement for minimal downtime.
Industry Applications
Fourier Powers the Future
of Al & HPC
Our global team is happy to assist with your modular data center project needs.
