St. Louis, USA – November 2025 – Fourier, a modular data center brand specializing in AI and HPC infrastructure, will showcase its latest innovations at SC25 (Supercomputing 2025) from November 18 to 20 at the America’s Center.
At the event, Fourier will present a “cold-plate + fan-wall” modular container model, together with other high-density cooling modules designed for rapid deployment and efficient expansion of AI-ready data-center clusters.
Meeting the AI-Density Challenge
Global data-center capacity for AI workloads is growing at an annual rate of roughly 33%, and by 2030 over 70% of new capacity will be built for advanced AI applications.
As hyperscale operators and colocation providers race to deliver infrastructure capable of 100 kW-plus per-rack densities, the industry faces simultaneous demands for shorter deployment cycles, higher efficiency, and tighter thermal control.
Even as new supply enters the market, North America’s primary colocation vacancy rate remains near 1.6%, underscoring the urgency for faster-to-build, high-density data-center formats.
What Fourier Will Showcase at SC25
“Cold-Plate + Fan-Wall” Container Model – Integrates direct-to-chip cold-plate cooling with fan-wall air management for balanced heat removal and controlled airflow within each pod. Ideal for both greenfield expansion and legacy-site retrofits.
Prefabricated Micro Modules – Standardized rack layouts and pre-assembled piping enable accelerated on-site installation and commissioning.
Monitoring & Control System: Layered environmental and coolant monitoring designed for high-heat-flux GPU clusters, ensuring real-time stability and redundancy.
Industry Outlook: Liquid Cooling Becomes the Default
With rack power densities climbing beyond what traditional air systems can handle, liquid cooling is rapidly becoming the default deployment standard for new data centers.
In the near term, hybrid topologies—liquid for chips, air for balance—offer a pragmatic path, while coldplate and rear door heat exchanger solutions continue to scale.
Analysts forecast the global data-center liquid-cooling market to maintain double-digit growth, reaching tens of billions of USD by 2030.
Technical Frontiers: Micro-Channel Cold-Plates Push Thermal Limits
Emerging micro-channel cold-plate designs that bring coolant directly to the backside of chips can lower peak junction temperatures by up to 3 × compared with conventional designs.
Fourier’s container and module architecture is built with forward-compatibility for these next-generation cold-plate interfaces, allowing clients to adopt higher-density GPUs and 3D-packaged chips without re-engineering entire systems.
Four Core Advantages
High Density Readiness – Optimized for air-liquid coordination.
Scalable Modularity: Prefabricated production enabling global parallel delivery and fast replication.
Retrofit Ease – Deployable in existing campuses with minimal civil-work modification.
Lifecycle Efficiency – End-to-end optimization from design to O&M for energy and reliability.
Visit Fourier at SC25
Exhibition Dates: November 18–20, 2025
Venue: America’s Center Convention Complex, St. Louis (MO, USA)
Fourier’s team will be on-site to discuss high-density liquid-cooling deployment, large-scale retrofit strategies, and supply-chain acceleration for global HPC and AI projects.